Immersion Gold Single Sided 8 Layer HDI Rigid Custom PCB Board Design (1+6+1)
Material: FR4
Surface treatment: immersion Gold
Width/space: 3/3mil Finish thickness: 1.6m
Min Hot:0.1mm
SPECIFICATION
Materials
Polyimide
Polyester ( PET)
Remark&
(Kapton)
Test Method
1~8(Rigid-Flex & Multilayers FPC)
1~2
Single Sided
0.050 mm
Double Sided
0.075 mm
Drilling P.T.H.
0.2 mm
Punching
1.0 mm
Conductor Width (W)
0.025 mm
W0.5mm
Hole Diameter (H)
0.05 mm (withP.T.H.0.1mm)
H1.5mm
Accumulated Pitch (P)
0.05 mm (Special0.03mm)
P25mm
Outline Dimension (L)
0.05 mm
L50 mm
Conductors and Outline (C)
0.15 mm (Special 0.07mm)
C5.0 mm
Conductors and Coverlay
0.3~0.5 mm
Surface Treatment on
Soft or Hard Ni/Au Sn/Pb (2~60μm)
Primary FluxCarbon Printed
4~10μm Silver Gel printed
Terminals and land Areas
Insulation Resistance
1000MW
IPC-TM-650 2.6.3.2
at Ambient
Dielectric Strength
5KV
IPC-TM-650 2.5.6.1
Surface Resistance (W)
5x012
2x015
IPC-TM-650 2.5.17
Volume Resistivity (W-cm)
1x015
Dielectric Constant (1 MHz)
4
3.4
IPC-TM-650 2.5.5.3
Dissipation Factor (1 MHz)
0.04
0.02
Peeling Strength (180 irection)
1.2kgf/cm
IPC-TM-650 2.4.9
Solder Heat Resistance
260 .C/10secs
210 .C/3secs
Flammability
94 V-0
94VTM-0
UL94
Water Absorption
2.90%
1.00%
ASTM D570%
(24 Hours)